MCF5235CVM150
vs
MPC850ZT50
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Package Description |
ROHS COMPLIANT, MAPBGA-256
|
BGA,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A002.A.1
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
13 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| Additional Feature |
LOW POWER MODE TAKEN FROM LOW POWER MODE
|
SUPPORTS MULTIPLE PROTOCOLS
|
| Address Bus Width |
24
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
75 MHz
|
|
| External Data Bus Width |
32
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B256
|
R-PBGA-B256
|
| JESD-609 Code |
e1
|
|
| Length |
17 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
BGA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
|
| Speed |
150 MHz
|
|
| Supply Voltage-Max |
1.6 V
|
|
| Supply Voltage-Min |
1.4 V
|
|
| Supply Voltage-Nom |
1.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Silver/Copper - with Nickel barrier
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
17 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
256
|
|
|
|
Compare MCF5235CVM150 with alternatives
Compare MPC850ZT50 with alternatives