MCF5235CVM150 vs MPC870CZT66 feature comparison

MCF5235CVM150 Freescale Semiconductor

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MPC870CZT66 Freescale Semiconductor

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description ROHS COMPLIANT, MAPBGA-256 PLASTIC, BGA-256
Pin Count 256 256
Reach Compliance Code compliant not_compliant
ECCN Code 5A002.A 5A992
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Additional Feature LOW POWER MODE TAKEN FROM LOW POWER MODE
Address Bus Width 24 32
Bit Size 32 32
Boundary Scan YES YES
CPU Family COLDFIRE
Clock Frequency-Max 75 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 17 mm 23 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA HBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
RAM (bytes) 65536
Seated Height-Max 1.6 mm 2.54 mm
Speed 150 MHz 66 MHz
Supply Current-Max 150 mA
Supply Voltage-Max 1.6 V 1.9 V
Supply Voltage-Min 1.4 V 1.7 V
Supply Voltage-Nom 1.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER OVER NICKEL Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 17 mm 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
JESD-609 Code e0

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