MCF5235CVM100
vs
MPC852TVR66
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Part Package Code
BGA
BGA
Package Description
LBGA,
BGA, BGA256,16X16,50
Pin Count
256
256
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
24
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
75 MHz
66 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
23 mm
Low Power Mode
YES
YES
Number of Terminals
256
256
Operating Temperature-Max
85 °C
95 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
2.54 mm
Speed
100 MHz
66 MHz
Supply Voltage-Max
1.65 V
1.9 V
Supply Voltage-Min
1.35 V
1.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Moisture Sensitivity Level
3
Package Equivalence Code
BGA256,16X16,50
Supply Voltage-Nom
1.8 V
Compare MCF5235CVM100 with alternatives
Compare MPC852TVR66 with alternatives