MCF5235CVM100
vs
XPC850CZT50BUR2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
ROHS COMPLIANT, MAPBGA-256
PLASTIC, BGA-256
Pin Count
256
256
Reach Compliance Code
compliant
not_compliant
ECCN Code
5A002.A
5A991
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
LOW POWER MODE TAKEN FROM LOW POWER MODE
Address Bus Width
24
26
Bit Size
32
32
Boundary Scan
YES
YES
CPU Family
COLDFIRE
Clock Frequency-Max
75 MHz
50 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
23 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
256
256
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
260
220
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
65536
Seated Height-Max
1.6 mm
2.35 mm
Speed
100 MHz
50 MHz
Supply Current-Max
150 mA
Supply Voltage-Max
1.6 V
3.465 V
Supply Voltage-Min
1.4 V
3.135 V
Supply Voltage-Nom
1.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER OVER NICKEL
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
17 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
4
3
JESD-609 Code
e0
Compare MCF5235CVM100 with alternatives
Compare XPC850CZT50BUR2 with alternatives