MCF52277CVM160 vs MCF5275LCVM166 feature comparison

MCF52277CVM160 NXP Semiconductors

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MCF5275LCVM166 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 15 X 15 MM, ROHS COMPLIANT, MAPBGA-196 ROHS COMPLIANT, MAPBGA-196
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 5A002.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks 13 Weeks
Address Bus Width 24 24
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 83 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B196 S-PBGA-B196
JESD-609 Code e1 e1
Length 15 mm 15 mm
Low Power Mode NO YES
Moisture Sensitivity Level 3 3
Number of Terminals 196 196
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LBGA
Package Equivalence Code BGA196,14X14,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.6 mm
Speed 166.67 MHz 166 MHz
Supply Current-Max 0.7 mA
Supply Voltage-Max 1.6 V 1.6 V
Supply Voltage-Min 1.4 V 1.4 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 15 mm 15 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRES 3.3V SUPPLY

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