MC9S12XEP100J1MAA
vs
MC9S12XEP100J1MAAR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
PLASTIC, QFP-80
PLASTIC, QFP-80
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
16
16
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
YES
YES
DMA Channels
YES
YES
External Data Bus Width
16
16
JESD-30 Code
S-PQFP-G80
S-PQFP-G80
Length
14 mm
14 mm
Number of I/O Lines
Number of Terminals
80
80
On Chip Program ROM Width
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
ROM (words)
1048576
1048576
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.45 mm
2.45 mm
Speed
50 MHz
50 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
3.13 V
3.13 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
2
1
Compare MC9S12XEP100J1MAA with alternatives
Compare MC9S12XEP100J1MAAR with alternatives