MC9S12XDP512VFV
vs
MC9S12XDP512CAG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
QFP
Package Description
LFQFP, QFP144,.87SQ,20
LEAD FREE, LQFP-144
Pin Count
144
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Additional Feature
IT ALSO REQUIRES 5 V SUPPLY
IT ALSO REQUIRES 5 V SUPPLY
Address Bus Width
Bit Size
16
16
CPU Family
CPU12
CPU12
Clock Frequency-Max
80 MHz
80 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PQFP-G144
S-PQFP-G144
JESD-609 Code
e3
e3
Length
20 mm
20 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
119
119
Number of Terminals
144
144
On Chip Program ROM Width
8
8
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Equivalence Code
QFP144,.87SQ,20
QFP144,.87SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
220
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
32768
32768
ROM (words)
524288
524288
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
40 MHz
40 MHz
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.35 V
2.5 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
40
Width
20 mm
20 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
3
2
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Compare MC9S12XDP512VFV with alternatives
Compare MC9S12XDP512CAG with alternatives