MC9S12XDP512CAG
vs
MC9S12XDP512CFV
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Package Description
LEAD FREE, LQFP-144
QFP, QFP144,.87SQ,20
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Has ADC
YES
Additional Feature
IT ALSO REQUIRES 5 V SUPPLY
Address Bus Width
Bit Size
16
16
CPU Family
CPU12
CPU12
Clock Frequency-Max
80 MHz
DAC Channels
NO
DMA Channels
YES
External Data Bus Width
JESD-30 Code
S-PQFP-G144
S-PQFP-G144
JESD-609 Code
e3
Length
20 mm
Moisture Sensitivity Level
3
Number of I/O Lines
119
Number of Terminals
144
144
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QFP
Package Equivalence Code
QFP144,.87SQ,20
QFP144,.87SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
32768
32768
ROM (words)
524288
524288
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
Speed
40 MHz
25 MHz
Supply Voltage-Max
2.75 V
Supply Voltage-Min
2.5 V
Supply Voltage-Nom
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Width
20 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Base Number Matches
2
3
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