MC9S12DB128CFUE
vs
MC9S12DB128VFU
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MOTOROLA INC
Part Package Code
QFP
QFP
Package Description
PLASTIC, LQFP-80
QFP, QFP80,.68SQ
Pin Count
80
80
Reach Compliance Code
unknown
unknown
Has ADC
YES
YES
Address Bus Width
16
16
Bit Size
16
16
Clock Frequency-Max
50 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
16
16
JESD-30 Code
S-PQFP-G80
S-PQFP-G80
JESD-609 Code
e0
Length
14 mm
14 mm
Moisture Sensitivity Level
3
Number of I/O Lines
59
59
Number of Terminals
80
80
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Peak Reflow Temperature (Cel)
220
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.45 mm
2.45 mm
Speed
25 MHz
25 MHz
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.35 V
2.35 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
14 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
HTS Code
8542.31.00.01
Additional Feature
ALSO REQUIRES 5V SUPPLY
CPU Family
CPU12
On Chip Program ROM Width
8
Package Equivalence Code
QFP80,.68SQ
Qualification Status
Not Qualified
RAM (bytes)
8192
ROM (words)
65536
Compare MC9S12DB128CFUE with alternatives
Compare MC9S12DB128VFU with alternatives