MC9S08SH8CTJR
vs
MC9S08QD4CPC
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
ROCHESTER ELECTRONICS LLC
Part Package Code
TSSOP
DIP
Package Description
0.65 MM PITCH, TSSOP-20
ROHS COMPLIANT, PLASTIC, DIP-8
Pin Count
20
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDSO-G20
R-PDIP-T8
JESD-609 Code
e3
e3
Length
6.5 mm
9.779 mm
Moisture Sensitivity Level
3
NOT SPECIFIED
Number of I/O Lines
18
4
Number of Terminals
20
8
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP20,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
RAM (bytes)
512
ROM (words)
8192
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.2 mm
5.334 mm
Speed
40 MHz
16 MHz
Supply Current-Max
7.7 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.7 V
2.7 V
Supply Voltage-Nom
3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
4.4 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
3
Compare MC9S08SH8CTJR with alternatives
Compare MC9S08QD4CPC with alternatives