MC9S08RG32FGE vs MC9S08RE8CPE feature comparison

MC9S08RG32FGE NXP Semiconductors

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MC9S08RE8CPE Freescale Semiconductor

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Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 10 X 10 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BCB, LQFP-44 DIP,
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 52 Weeks
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Boundary Scan NO
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G44 R-PDIP-T28
JESD-609 Code e3
Length 10 mm 36.83 mm
Moisture Sensitivity Level 3
Number of I/O Lines 39 23
Number of Terminals 44 28
On Chip Program ROM Width 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP DIP
Package Equivalence Code QFP44,.47SQ,32
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 2048
ROM (words) 32768
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 5.08 mm
Speed 8 MHz 8 MHz
Supply Current-Max 4.8 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 1.8 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.8 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 10 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
Part Package Code DIP
Pin Count 28

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