MC9S08RE8CPE
vs
MC9S08RE60FJE
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
DIP
|
QFP
|
Package Description |
DIP,
|
LQFP, QFP32,.35SQ,32
|
Pin Count |
28
|
32
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDIP-T28
|
S-PQFP-G32
|
Length |
36.83 mm
|
7 mm
|
Number of I/O Lines |
23
|
27
|
Number of Terminals |
28
|
32
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
LQFP
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
FLATPACK, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
5.08 mm
|
1.6 mm
|
Speed |
8 MHz
|
8 MHz
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
1.8 V
|
1.8 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
15.24 mm
|
7 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
Yes
|
ECCN Code |
|
EAR99
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
On Chip Program ROM Width |
|
8
|
Package Equivalence Code |
|
QFP32,.35SQ,32
|
Peak Reflow Temperature (Cel) |
|
260
|
RAM (bytes) |
|
2048
|
ROM (words) |
|
61440
|
Supply Current-Max |
|
4.8 mA
|
Terminal Finish |
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MC9S08RE8CPE with alternatives
Compare MC9S08RE60FJE with alternatives