MC9S08RG32FG
vs
MC9S08RE8FDE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Part Package Code
QFP
Package Description
LQFP, QFP44,.47SQ,32
7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-220VKKD-2, TQFN-48
Pin Count
44
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G44
S-XQCC-N48
Length
10 mm
7 mm
Number of I/O Lines
39
39
Number of Terminals
44
48
On Chip Program ROM Width
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
LQFP
HVQCCN
Package Equivalence Code
QFP44,.47SQ,32
LCC48,.27SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
2048
1024
ROM (words)
32768
8192
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1 mm
Speed
8 MHz
8 MHz
Supply Current-Max
4.8 mA
4.8 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
3 V
Supply Voltage-Nom
2 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
10 mm
7 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
3
2
Boundary Scan
NO
CPU Family
HCS08
Format
FIXED POINT
Integrated Cache
NO
Low Power Mode
YES
Number of External Interrupts
1
Number of Serial I/Os
1
Number of Timers
3
On Chip Data RAM Width
8
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Compare MC9S08RE8FDE with alternatives