MC9S08RG32CFG vs MC9S08RE16FJ feature comparison

MC9S08RG32CFG Freescale Semiconductor

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MC9S08RE16FJ Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MOTOROLA INC
Part Package Code QFP QFP
Package Description 10 X 10 MM, 1.40 MM THICKNESS, 0.80 MM PITCH, MS-026BCB, LQFP-44 LQFP, QFP32,.35SQ,32
Pin Count 44 32
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G44 S-PQFP-G32
JESD-609 Code e0
Length 10 mm 7 mm
Moisture Sensitivity Level 3
Number of I/O Lines 39 27
Number of Terminals 44 32
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Equivalence Code QFP44,.47SQ,32 QFP32,.35SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (bytes) 2048 1024
ROM (words) 32768 16384
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 8 MHz 8 MHz
Supply Current-Max 4.8 mA 4.8 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 2 V 1.8 V
Supply Voltage-Nom 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 10 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 1

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