MC9S08RG32CFG
vs
MC9S08RE8CFJ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
MOTOROLA INC
Part Package Code
QFP
QFP
Package Description
LQFP,
LQFP, QFP32,.35SQ,32
Pin Count
44
32
Reach Compliance Code
unknown
unknown
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G44
S-PQFP-G32
Length
10 mm
7 mm
Number of I/O Lines
39
27
Number of Terminals
44
32
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
8 MHz
8 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
10 mm
7 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
4
4
HTS Code
8542.31.00.01
On Chip Program ROM Width
8
Package Equivalence Code
QFP32,.35SQ,32
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
RAM (bytes)
1024
ROM (words)
8192
Supply Current-Max
4.8 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC9S08RG32CFG with alternatives
Compare MC9S08RE8CFJ with alternatives