MC9S08RE8CFDE
vs
MC9S08RE60FJE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
QFN
Package Description
HVQCCN,
,
Pin Count
48
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-XQCC-N48
S-PQFP-G32
Length
7 mm
7 mm
Number of I/O Lines
39
27
Number of Terminals
48
32
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
YES
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
LQFP
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, LOW PROFILE
Qualification Status
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
1 mm
1.6 mm
Speed
8 MHz
8 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
7 mm
7 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Boundary Scan
NO
CPU Family
HCS08
Format
FIXED POINT
Integrated Cache
NO
Low Power Mode
YES
Number of External Interrupts
1
Number of Serial I/Os
1
Number of Timers
3
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Package Equivalence Code
QFP32,.35SQ,32
Peak Reflow Temperature (Cel)
260
RAM (bytes)
2048
ROM (words)
61440
Supply Current-Max
4.8 mA
Time@Peak Reflow Temperature-Max (s)
40
Compare MC9S08RE8CFDE with alternatives
Compare MC9S08RE60FJE with alternatives