MC9S08RE8CFDE
vs
MC9S08RE16FG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
QFN
QFP
Package Description
HVQCCN,
LQFP, QFP44,.47SQ,32
Pin Count
48
44
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-XQCC-N48
S-PQFP-G44
Length
7 mm
10 mm
Number of I/O Lines
39
39
Number of Terminals
48
44
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
YES
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
LQFP
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
1 mm
1.6 mm
Speed
8 MHz
8 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
3 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
7 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
4
On Chip Program ROM Width
8
Package Equivalence Code
QFP44,.47SQ,32
Peak Reflow Temperature (Cel)
NOT SPECIFIED
RAM (bytes)
1024
ROM (words)
16384
Supply Current-Max
4.8 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC9S08RE8CFDE with alternatives
Compare MC9S08RE16FG with alternatives