MC9S08RE32FJE vs MC9S08RE16CPE feature comparison

MC9S08RE32FJE NXP Semiconductors

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MC9S08RE16CPE NXP Semiconductors

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Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description LQFP, ROHS COMPLIANT, PLASTIC, DIP-28
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Boundary Scan NO NO
CPU Family HCS08 HCS08
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G32 R-PDIP-T28
Length 7 mm 36.83 mm
Low Power Mode YES YES
Number of External Interrupts 1 1
Number of I/O Lines 27 23
Number of Serial I/Os 1 1
Number of Terminals 32 28
Number of Timers 3 3
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP DIP
Package Equivalence Code QFP32,.35SQ,32 DIP28,.6
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE IN-LINE
RAM (bytes) 2048 1024
ROM (words) 32768 16384
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 5.08 mm
Speed 8 MHz 8 MHz
Supply Current-Max 4.8 mA 4.8 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.8 mm 2.54 mm
Terminal Position QUAD DUAL
Width 7 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL

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