MC9S08RE32FJE
vs
MC9S08RE16CPE
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
LQFP,
|
ROHS COMPLIANT, PLASTIC, DIP-28
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
NO
|
CPU Family |
HCS08
|
HCS08
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-PQFP-G32
|
R-PDIP-T28
|
Length |
7 mm
|
36.83 mm
|
Low Power Mode |
YES
|
YES
|
Number of External Interrupts |
1
|
1
|
Number of I/O Lines |
27
|
23
|
Number of Serial I/Os |
1
|
1
|
Number of Terminals |
32
|
28
|
Number of Timers |
3
|
3
|
On Chip Data RAM Width |
8
|
8
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
DIP
|
Package Equivalence Code |
QFP32,.35SQ,32
|
DIP28,.6
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK, LOW PROFILE
|
IN-LINE
|
RAM (bytes) |
2048
|
1024
|
ROM (words) |
32768
|
16384
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.6 mm
|
5.08 mm
|
Speed |
8 MHz
|
8 MHz
|
Supply Current-Max |
4.8 mA
|
4.8 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.8 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
7 mm
|
15.24 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
Qualification Status |
|
Not Qualified
|
Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare MC9S08RE32FJE with alternatives
Compare MC9S08RE16CPE with alternatives