MC9S08RE16CDWE vs MC9S08RG32CFDE feature comparison

MC9S08RE16CDWE Freescale Semiconductor

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MC9S08RG32CFDE Freescale Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code SOIC QFN
Package Description SOP, HVQCCN, LCC48,.27SQ,20
Pin Count 28 48
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G28 S-XQCC-N48
Length 17.925 mm 7 mm
Number of I/O Lines 23 39
Number of Terminals 28 48
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP HVQCCN
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 2.65 mm 1 mm
Speed 8 MHz 8 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 1.8 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL QUAD
Width 7.5 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 2
Rohs Code Yes
ECCN Code EAR99
CPU Family HCS08
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Package Equivalence Code LCC48,.27SQ,20
Peak Reflow Temperature (Cel) 260
RAM (bytes) 2048
ROM (words) 32768
Supply Current-Max 4.8 mA
Time@Peak Reflow Temperature-Max (s) 40

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