MC9S08RE16CDWE
vs
MC9S08RD16CFJ
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
ROHS COMPLIANT, MS-013AE, SOIC-28
|
7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
|
CPU Family |
HCS08
|
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
R-PDSO-G28
|
S-PQFP-G32
|
Length |
17.925 mm
|
7 mm
|
Low Power Mode |
YES
|
|
Number of External Interrupts |
1
|
|
Number of I/O Lines |
23
|
27
|
Number of Serial I/Os |
1
|
|
Number of Terminals |
28
|
32
|
Number of Timers |
3
|
|
On Chip Data RAM Width |
8
|
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
LQFP
|
Package Equivalence Code |
SOP28,.4
|
QFP32,.35SQ,32
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
FLATPACK, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
1024
|
1024
|
ROM (words) |
16384
|
16384
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
2.65 mm
|
1.6 mm
|
Speed |
8 MHz
|
8 MHz
|
Supply Current-Max |
4.8 mA
|
4.8 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
2 V
|
Supply Voltage-Nom |
3 V
|
2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
7.5 mm
|
7 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
4
|
Rohs Code |
|
No
|
Part Package Code |
|
QFP
|
Pin Count |
|
32
|
ECCN Code |
|
EAR99
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
240
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MC9S08RE16CDWE with alternatives
Compare MC9S08RD16CFJ with alternatives