MC9S08RC16CFJ vs MC9S08RG32DWE feature comparison

MC9S08RC16CFJ Rochester Electronics LLC

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MC9S08RG32DWE NXP Semiconductors

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Pbfree Code Yes
Rohs Code No
Part Life Cycle Code Active Active
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code QFP
Package Description LQFP-32 ROHS COMPLIANT, MS-013AE, SOIC-28
Pin Count 32
Reach Compliance Code unknown unknown
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G32 R-PDSO-G28
JESD-609 Code e0
Length 7 mm 17.925 mm
Moisture Sensitivity Level 3
Number of I/O Lines 27 23
Number of Terminals 32 28
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP SOP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 2.65 mm
Speed 8 MHz 8 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 3 V
Supply Voltage-Nom 2 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7 mm 7.5 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 4 2
HTS Code 8542.31.00.01
Boundary Scan NO
CPU Family HCS08
Format FIXED POINT
Integrated Cache NO
Low Power Mode YES
Number of External Interrupts 1
Number of Serial I/Os 1
Number of Timers 3
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Package Equivalence Code SOP28,.4
Qualification Status Not Qualified
RAM (bytes) 2048
ROM (words) 32768
Supply Current-Max 4.8 mA

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