MC9S08RG32DWE vs MC9S08RE8FJE feature comparison

MC9S08RG32DWE Freescale Semiconductor

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MC9S08RE8FJE Freescale Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code SOIC QFP
Package Description SOP, LQFP, QFP32,.35SQ,32
Pin Count 28 32
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G28 S-PQFP-G32
Length 17.925 mm 7 mm
Number of I/O Lines 23 27
Number of Terminals 28 32
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP LQFP
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE FLATPACK, LOW PROFILE
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 2.65 mm 1.6 mm
Speed 8 MHz 8 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 1.8 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position DUAL QUAD
Width 7.5 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 3
Pbfree Code Yes
Rohs Code Yes
ECCN Code EAR99
JESD-609 Code e3
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Package Equivalence Code QFP32,.35SQ,32
Peak Reflow Temperature (Cel) 260
RAM (bytes) 1024
ROM (words) 8192
Supply Current-Max 4.8 mA
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40

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