MC9S08QG8CPBE
vs
MC9S08QG8MPBE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Package Description
ROHS COMPLIANT, PLASTIC, DIP-16
ROHS COMPLIANT, PLASTIC, DIP-16
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Samacsys Manufacturer
NXP
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
20 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e3
e3
Length
19.175 mm
19.175 mm
Number of I/O Lines
14
14
Number of Terminals
16
16
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
RAM (bytes)
512
ROM (words)
8192
ROM Programmability
FLASH
FLASH
Seated Height-Max
4.44 mm
4.44 mm
Speed
20 MHz
20 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
1.8 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Tin (Sn)
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
7.62 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Pbfree Code
Part Package Code
DIP
Pin Count
16
Moisture Sensitivity Level
NOT SPECIFIED
Compare MC9S08QG8CPBE with alternatives
Compare MC9S08QG8MPBE with alternatives