MC9S08QG8MPBE
vs
MC9S08QG8CDTER
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
TSSOP
Package Description
ROHS COMPLIANT, PLASTIC, DIP-16
0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16
Pin Count
16
16
Reach Compliance Code
unknown
unknown
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
20 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e3
e3
Length
19.175 mm
5 mm
Moisture Sensitivity Level
NOT SPECIFIED
3
Number of I/O Lines
14
14
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
ROM Programmability
FLASH
FLASH
Seated Height-Max
4.44 mm
1.2 mm
Speed
20 MHz
20 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Width
7.62 mm
4.4 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
3
3
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