MC9S08QG8CFFER
vs
MC9S08QG8MPBE
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
ROCHESTER ELECTRONICS LLC
Part Package Code
QFN
DIP
Package Description
VQCCN,
ROHS COMPLIANT, PLASTIC, DIP-16
Pin Count
16
16
Reach Compliance Code
unknown
unknown
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-XQCC-N16
R-PDIP-T16
JESD-609 Code
e3
e3
Length
5 mm
19.175 mm
Moisture Sensitivity Level
3
NOT SPECIFIED
Number of I/O Lines
14
14
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VQCCN
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, VERY THIN PROFILE
IN-LINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
ROM Programmability
FLASH
FLASH
Seated Height-Max
1 mm
4.44 mm
Speed
16 MHz
20 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
0.8 mm
2.54 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
5 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
3
3
Rohs Code
Compare MC9S08QG8CFFER with alternatives
Compare MC9S08QG8MPBE with alternatives