MC9S08QG8CFFER
vs
MC9S08QG8MFFE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
VQCCN, LCC16,.2SQ,32
5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
4 Weeks
Samacsys Manufacturer
NXP
NXP
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-XQCC-N16
S-XQCC-N16
JESD-609 Code
e3
Length
5 mm
5 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
14
14
Number of Terminals
16
16
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
VQCCN
HVQCCN
Package Equivalence Code
LCC16,.2SQ,32
LCC16,.2SQ,32
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
512
512
ROM (words)
8192
8192
ROM Programmability
FLASH
FLASH
Seated Height-Max
1 mm
1 mm
Speed
16 MHz
20 MHz
Supply Current-Max
5 mA
5 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
1.8 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
5 mm
5 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Compare MC9S08QG8CFFER with alternatives
Compare MC9S08QG8MFFE with alternatives