MC9S08QG4CFFER
vs
MC9S08QG4CDTER
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
ROCHESTER ELECTRONICS LLC
Part Package Code
QFN
TSSOP
Package Description
5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16
0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16
Pin Count
16
16
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
20 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-XQCC-N16
R-PDSO-G16
Length
5 mm
5 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
14
14
Number of Terminals
16
16
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
TSSOP
Package Equivalence Code
LCC16,.2SQ,32
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
RAM (bytes)
256
ROM (words)
4096
ROM Programmability
FLASH
FLASH
Seated Height-Max
1 mm
1.2 mm
Speed
20 MHz
20 MHz
Supply Current-Max
5 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.8 mm
0.65 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Width
5 mm
4.4 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
3
JESD-609 Code
e3
Terminal Finish
MATTE TIN
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