MC9S08QG4CDTER
vs
MC9S08QG4MFFE
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16
|
HVQCCN, LCC16,.2SQ,32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
13 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G16
|
S-XQCC-N16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
14
|
14
|
| Number of Terminals |
16
|
16
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP16,.25
|
LCC16,.2SQ,32
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
256
|
256
|
| ROM (words) |
4096
|
4096
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Speed |
20 MHz
|
20 MHz
|
| Supply Current-Max |
5 mA
|
5 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
1.8 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
4.4 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
16
|
|
|
|
Compare MC9S08QG4CDTER with alternatives
Compare MC9S08QG4MFFE with alternatives