MC9S08QG4CFFER vs MC9S08QG4MDNE feature comparison

MC9S08QG4CFFER NXP Semiconductors

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MC9S08QG4MDNE Freescale Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16 SOP, SOP8,.25
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 20 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-XQCC-N16 R-PDSO-G8
Length 5 mm 4.9 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 14 6
Number of Terminals 16 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVQCCN SOP
Package Equivalence Code LCC16,.2SQ,32 SOP8,.25
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 256
ROM (words) 4096 4096
ROM Programmability FLASH FLASH
Seated Height-Max 1 mm 1.75 mm
Speed 20 MHz 20 MHz
Supply Current-Max 5 mA 5 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 1.8 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Width 5 mm 3.9 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Part Package Code SOIC
Pin Count 8
JESD-609 Code e3
Terminal Finish MATTE TIN

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