MC9S08QG4CFFER
vs
MC9S08QG4CFFE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS INC
Package Description
5 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, QFN-16
HVQCCN,
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
20 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-XQCC-N16
S-XQCC-N16
Length
5 mm
5 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
14
14
Number of Terminals
16
16
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC16,.2SQ,32
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
RAM (bytes)
256
ROM (words)
4096
ROM Programmability
FLASH
FLASH
Seated Height-Max
1 mm
1 mm
Speed
20 MHz
20 MHz
Supply Current-Max
5 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
1.8 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
5 mm
5 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Pbfree Code
Part Package Code
QFN
Pin Count
16
JESD-609 Code
e3
Terminal Finish
MATTE TIN
Compare MC9S08QG4CFFER with alternatives
Compare MC9S08QG4CFFE with alternatives