MC9S08QE32CFT
vs
DSPIC33FJ32GP302-H/TPT
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
MICROCHIP TECHNOLOGY INC
Part Package Code
QFN
QFP
Package Description
HVQCCN,
10 X 10 MM, 2 MM HEIGHT, LEAD FREE, PLASTIC, QFP-44
Pin Count
48
44
Reach Compliance Code
unknown
compliant
Has ADC
YES
Address Bus Width
Bit Size
8
16
Clock Frequency-Max
16 MHz
40 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
JESD-30 Code
S-XQCC-N48
S-PQFP-G44
JESD-609 Code
e3
e3
Length
7 mm
10 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
40
Number of Terminals
48
44
Operating Temperature-Max
85 °C
140 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
TQFP
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
ROM Programmability
FLASH
FLASH
Seated Height-Max
1 mm
1.2 mm
Speed
50.33 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
3 V
Supply Voltage-Nom
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
7 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
3
1
Rohs Code
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Qualification Status
Not Qualified
Compare MC9S08QE32CFT with alternatives
Compare DSPIC33FJ32GP302-H/TPT with alternatives