MC9S08QA2CFCE vs MC9S08SH8MPJ feature comparison

MC9S08QA2CFCE Freescale Semiconductor

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MC9S08SH8MPJ NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code DFN
Package Description HVSON, 0.300 INCH, PLASTIC, DIP-20
Pin Count 8
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 10 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PDSO-N8 R-PDIP-T20
Length 4 mm 24.69 mm
Number of I/O Lines 6 18
Number of Terminals 8 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON DIP
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 1 mm 5.08 mm
Speed 10 MHz 40 MHz
Supply Voltage-Max 3.6 V 5.5 V
Supply Voltage-Min 1.8 V 2.7 V
Supply Voltage-Nom 2.7 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 0.8 mm 2.54 mm
Terminal Position DUAL DUAL
Width 4 mm 7.62 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 3
Rohs Code Yes
ECCN Code EAR99
Samacsys Manufacturer NXP
JESD-609 Code e3
On Chip Program ROM Width 8
Package Equivalence Code DIP20,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
RAM (bytes) 512
ROM (words) 8192
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare MC9S08SH8MPJ with alternatives