MC9S08QA2CFCE
vs
MC9S08SH8MPJ
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
DFN
|
|
Package Description |
HVSON,
|
0.300 INCH, PLASTIC, DIP-20
|
Pin Count |
8
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
10 MHz
|
16 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PDSO-N8
|
R-PDIP-T20
|
Length |
4 mm
|
24.69 mm
|
Number of I/O Lines |
6
|
18
|
Number of Terminals |
8
|
20
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
DIP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1 mm
|
5.08 mm
|
Speed |
10 MHz
|
40 MHz
|
Supply Voltage-Max |
3.6 V
|
5.5 V
|
Supply Voltage-Min |
1.8 V
|
2.7 V
|
Supply Voltage-Nom |
2.7 V
|
3 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Pitch |
0.8 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
4 mm
|
7.62 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
3
|
Rohs Code |
|
Yes
|
ECCN Code |
|
EAR99
|
Samacsys Manufacturer |
|
NXP
|
JESD-609 Code |
|
e3
|
On Chip Program ROM Width |
|
8
|
Package Equivalence Code |
|
DIP20,.3
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
RAM (bytes) |
|
512
|
ROM (words) |
|
8192
|
Terminal Finish |
|
Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MC9S08QA2CFCE with alternatives
Compare MC9S08SH8MPJ with alternatives