MC9S08SH8MPJ vs MC9S08QD4VSC feature comparison

MC9S08SH8MPJ NXP Semiconductors

Buy Now Datasheet

MC9S08QD4VSC NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 0.300 INCH, PLASTIC, DIP-20 ROHS COMPLIANT, MS-012AA, SOIC-8
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDIP-T20 R-PDSO-G8
JESD-609 Code e3 e3
Length 24.69 mm 4.9 mm
Number of I/O Lines 18 4
Number of Terminals 20 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 125 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP20,.3 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 512 256
ROM (words) 8192 4096
ROM Programmability FLASH FLASH
Seated Height-Max 5.08 mm 1.75 mm
Speed 40 MHz 16 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 5 V
Supply Voltage-Nom 3 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 7.62 mm 3.9 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 3
Factory Lead Time 13 Weeks
Additional Feature IT ALSO OPERATES AT 3V SUPPLY
Moisture Sensitivity Level 3
Supply Current-Max 2.2 mA

Compare MC9S08SH8MPJ with alternatives

Compare MC9S08QD4VSC with alternatives