MC9S08JE128CMB
vs
MC9S08JE128CMB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
10 X 10 MM, ROHS COMPLIANT, MAPBGA-81
|
LBGA,
|
| Pin Count |
81
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PBGA-B81
|
S-PBGA-B81
|
| JESD-609 Code |
e1
|
|
| Length |
10 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
50
|
50
|
| Number of Terminals |
81
|
81
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.52 mm
|
1.52 mm
|
| Speed |
48 MHz
|
48 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
1.8 V
|
1.8 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER OVER NICKEL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
10 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.31.00.01
|
| Factory Lead Time |
|
4 Weeks
|
| Date Of Intro |
|
2016-04-02
|
|
|
|