MC9S08AW60CFG
vs
MC9S08AW60CFGE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
10 X 10 MM, 1.40 MM THICKNESS, 0.80 MM PITCH, PLASTIC, MS-026BCB, LQFP-44
10 X 10 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MS-026BCB, LQFP-44
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Boundary Scan
NO
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G44
S-PQFP-G44
Length
10 mm
10 mm
Number of I/O Lines
34
54
Number of Terminals
44
44
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
ROM (words)
63280
63280
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
40 MHz
40 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.7 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
10 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
3
Rohs Code
Factory Lead Time
2 Days
Samacsys Manufacturer
NXP
JESD-609 Code
e3
Moisture Sensitivity Level
3
Package Equivalence Code
QFP44,.47SQ,32
Peak Reflow Temperature (Cel)
260
RAM (bytes)
2048
Terminal Finish
Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
40
Compare MC9S08AW60CFG with alternatives
Compare MC9S08AW60CFGE with alternatives