MC9328MXLVM15
vs
MC9328MX1CVM15
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MOTOROLA INC
Part Package Code
BGA
BGA
Package Description
14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256
LFBGA, BGA256,16X16,32
Pin Count
256
256
Reach Compliance Code
unknown
unknown
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
25
25
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
16 MHz
16 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
Length
14 mm
14 mm
Low Power Mode
YES
NO
Moisture Sensitivity Level
3
Number of Terminals
256
256
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Speed
150 MHz
150 MHz
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
14 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
5
5
HTS Code
8542.31.00.01
Package Equivalence Code
BGA256,16X16,32
Technology
CMOS
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