MC9328MX1CVM15 vs MC9328MXLDVM15 feature comparison

MC9328MX1CVM15 Motorola Mobility LLC

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MC9328MXLDVM15 NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description LFBGA, BGA256,16X16,32 MAPBGA-256
Pin Count 256
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01
Address Bus Width 25
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 16 MHz
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 14 mm 14 mm
Low Power Mode NO
Number of Terminals 256 256
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C -30 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA256,16X16,32 BGA256,16X16,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Speed 150 MHz
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC SoC
Base Number Matches 5 4
Pbfree Code Yes
Rohs Code Yes
Samacsys Manufacturer NXP

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