MC9328MXLDVP15
vs
KMC9328MXLVF15
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LFBGA,
|
LFBGA,
|
Pin Count |
225
|
225
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
25
|
25
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B225
|
S-PBGA-B225
|
Length |
13 mm
|
13 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
225
|
225
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-30 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Speed |
150 MHz
|
150 MHz
|
Supply Voltage-Max |
1.9 V
|
1.9 V
|
Supply Voltage-Min |
1.7 V
|
1.7 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
13 mm
|
13 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
4
|
3
|
Bit Size |
|
32
|
|
|
|
Compare MC9328MXLDVP15 with alternatives
Compare KMC9328MXLVF15 with alternatives