KMC9328MXLVF15
vs
MCF5251EVM140
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
LFBGA,
LEAD FREE, MAPBGA-225
Pin Count
225
225
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
25
24
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
16 MHz
140 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B225
S-PBGA-B225
Length
13 mm
13 mm
Low Power Mode
YES
NO
Number of Terminals
225
225
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Speed
150 MHz
140 MHz
Supply Voltage-Max
1.9 V
1.32 V
Supply Voltage-Min
1.7 V
1.08 V
Supply Voltage-Nom
1.8 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
3
1
Rohs Code
ECCN Code
3A991.A.2
Moisture Sensitivity Level
3
Package Equivalence Code
BGA225,15X15,32
Peak Reflow Temperature (Cel)
260
Terminal Finish
TIN SILVER COPPER OVER NICKEL
Time@Peak Reflow Temperature-Max (s)
40
Compare KMC9328MXLVF15 with alternatives
Compare MCF5251EVM140 with alternatives