MC9328MXL15
vs
XPC850DECVR50BU
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Package Description
LFBGA, BGA256,16X16,32
23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
25
26
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
16 MHz
50 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
14 mm
23 mm
Low Power Mode
YES
YES
Number of Terminals
256
256
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
BGA
Package Equivalence Code
BGA256,16X16,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
2.35 mm
Speed
150 MHz
50 MHz
Supply Voltage-Max
1.9 V
3.465 V
Supply Voltage-Min
1.7 V
3.135 V
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
1
Rohs Code
Part Package Code
BGA
Pin Count
256
ECCN Code
5A991
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
40
Compare MC9328MXL15 with alternatives
Compare XPC850DECVR50BU with alternatives