MC9328MXL15
vs
MPC850ZT33
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Package Description
LFBGA, BGA256,16X16,32
BGA,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
25
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
16 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B256
R-PBGA-B256
Length
14 mm
Low Power Mode
YES
Number of Terminals
256
256
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
BGA
Package Equivalence Code
BGA256,16X16,32
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
Speed
150 MHz
Supply Voltage-Max
1.9 V
Supply Voltage-Min
1.7 V
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
1
Additional Feature
SUPPORTS MULTIPLE PROTOCOLS
Compare MC9328MXL15 with alternatives
Compare MPC850ZT33 with alternatives