MC912DT128AMPVE
vs
KMC912DG128ACPV
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
TQFP-112
TQFP-112
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Has ADC
YES
YES
Address Bus Width
16
16
Bit Size
16
16
Boundary Scan
NO
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
16
16
JESD-30 Code
S-PQFP-G112
S-PQFP-G112
JESD-609 Code
e3
e0
Length
20 mm
20 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
83
83
Number of Terminals
112
112
On Chip Program ROM Width
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Not Qualified
ROM (words)
131072
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
8 MHz
8 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
HCMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Tin (Sn)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
20 mm
20 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Part Package Code
QFP
Pin Count
112
Compare MC912DT128AMPVE with alternatives
Compare KMC912DG128ACPV with alternatives