MC908QY8CP
vs
MC908QY2CDW
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
PLASTIC, DIP-16
1.27 MM PITCH, PLASTIC, MS-013AA, SOIC-16
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Additional Feature
OPERATES AT 3V SUPPLY AT 4 MHZ
ALSO OPERATES AT 3V SUPPLY AT 4 MHZ
Address Bus Width
Bit Size
8
8
Boundary Scan
NO
Clock Frequency-Max
32 MHz
32 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
Length
19.175 mm
10.3 mm
Number of I/O Lines
14
14
Number of Terminals
16
16
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
ROM (words)
8192
ROM Programmability
FLASH
FLASH
Seated Height-Max
4.44 mm
2.65 mm
Speed
8 MHz
8 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
HCMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.5 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
2
Compare MC908QY8CP with alternatives
Compare MC908QY2CDW with alternatives