MC8640DVU1067NE
vs
MC8641HX1500KC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023
33 X 33 MM, CERAMIC, BGA-1023
Pin Count
1023
1023
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.A.1
3A991
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
166.66 MHz
1500 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B1023
S-CBGA-B1023
JESD-609 Code
e2
e0
Length
33 mm
33 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
1023
1023
Operating Temperature-Max
105 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Equivalence Code
BGA1023,32X32,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.97 mm
2.97 mm
Speed
1067 MHz
166.66 MHz
Supply Voltage-Max
1 V
1.15 V
Supply Voltage-Min
0.9 V
1.05 V
Supply Voltage-Nom
0.95 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
Tin/Silver (Sn/Ag)
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
33 mm
33 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
1
Compare MC8640DVU1067NE with alternatives
Compare MC8641HX1500KC with alternatives