MC8640DVU1000HC
vs
MC8640DHX1000HE
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Reach Compliance Code |
compliant
|
unknown
|
Base Number Matches |
2
|
2
|
Package Description |
|
FCBGA-1023
|
ECCN Code |
|
3A991.A.2
|
HTS Code |
|
8542.31.00.01
|
Address Bus Width |
|
32
|
Bit Size |
|
32
|
Boundary Scan |
|
YES
|
Clock Frequency-Max |
|
166.66 MHz
|
External Data Bus Width |
|
32
|
Format |
|
FLOATING POINT
|
Integrated Cache |
|
YES
|
JESD-30 Code |
|
S-CBGA-B1023
|
Length |
|
33 mm
|
Low Power Mode |
|
NO
|
Number of DMA Channels |
|
4
|
Number of Terminals |
|
1023
|
Operating Temperature-Max |
|
105 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
|
CERAMIC
|
Package Code |
|
HBGA
|
Package Equivalence Code |
|
BGA1023,32X32,40
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, HEAT SINK/SLUG
|
Seated Height-Max |
|
2.97 mm
|
Speed |
|
1000 MHz
|
Supply Voltage-Max |
|
1.1 V
|
Supply Voltage-Min |
|
1 V
|
Supply Voltage-Nom |
|
1.05 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
OTHER
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
33 mm
|
uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR, RISC
|
|
|
|