MC8640DTVU1000HC
vs
MPC8572CVTARLD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023
HBGA,
Pin Count
1023
1023
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
166.66 MHz
133 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B1023
S-PBGA-B1023
JESD-609 Code
e2
e2
Length
33 mm
33 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
1023
1023
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
BGA
HBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.97 mm
3.38 mm
Speed
1000 MHz
1067 MHz
Supply Voltage-Max
1.1 V
1.155 V
Supply Voltage-Min
1 V
1.045 V
Supply Voltage-Nom
1.05 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER
TIN SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
33 mm
33 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
1
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