MC8640DTVU1000HC vs MC8641DHX1333HB feature comparison

MC8640DTVU1000HC Freescale Semiconductor

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MC8641DHX1333HB NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023 BGA,
Pin Count 1023
Reach Compliance Code not_compliant unknown
ECCN Code 3A991 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 16
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 166.66 MHz 166.66 MHz
External Data Bus Width 32 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B1023 S-CBGA-B1023
JESD-609 Code e2
Length 33 mm 33 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 1023 1023
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.97 mm 2.97 mm
Speed 1000 MHz 1333 MHz
Supply Voltage-Max 1.1 V 1.1 V
Supply Voltage-Min 1 V 1 V
Supply Voltage-Nom 1.05 V 1.05 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 33 mm 33 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 2 2

Compare MC8640DTVU1000HC with alternatives

Compare MC8641DHX1333HB with alternatives