MC8640DTVU1000HC
vs
MC8640DTHX1000HE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Reach Compliance Code
compliant
unknown
Base Number Matches
2
2
Package Description
FCBGA-1023
ECCN Code
3A991.A.1
HTS Code
8542.31.00.01
Factory Lead Time
4 Weeks
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
166.66 MHz
External Data Bus Width
32
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-CBGA-B1023
JESD-609 Code
e0
Length
33 mm
Low Power Mode
NO
Moisture Sensitivity Level
3
Number of DMA Channels
4
Number of Terminals
1023
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
HBGA
Package Equivalence Code
BGA1023,32X32,40
Package Shape
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Seated Height-Max
2.97 mm
Speed
1000 MHz
Supply Voltage-Max
1.1 V
Supply Voltage-Min
1 V
Supply Voltage-Nom
1.05 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
33 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
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