MC8640DTVJ1067NE
vs
MC8641HX1500KC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Package Description
FCBGA-1023
33 X 33 MM, CERAMIC, BGA-1023
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.A.1
3A991
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
32
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
64
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B1023
S-CBGA-B1023
JESD-609 Code
e2
e0
Length
33 mm
33 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
1023
1023
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Seated Height-Max
2.77 mm
2.97 mm
Speed
1067 MHz
166.66 MHz
Supply Voltage-Max
1 V
1.15 V
Supply Voltage-Min
0.9 V
1.05 V
Supply Voltage-Nom
0.95 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
33 mm
33 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
1023
Clock Frequency-Max
1500 MHz
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
30
Compare MC8640DTVJ1067NE with alternatives
Compare MC8641HX1500KC with alternatives