MC8640DTVJ1067NE
vs
MC8640DVU1067NE
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Package Description
FCBGA-1023
FCBGA-1023
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.1
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
32
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
64
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B1023
S-CBGA-B1023
JESD-609 Code
e2
Length
33 mm
33 mm
Low Power Mode
YES
NO
Moisture Sensitivity Level
3
Number of Terminals
1023
1023
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
HBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, HEAT SINK/SLUG
Seated Height-Max
2.77 mm
2.77 mm
Speed
1067 MHz
1067 MHz
Supply Voltage-Max
1 V
1 V
Supply Voltage-Min
0.9 V
0.9 V
Supply Voltage-Nom
0.95 V
0.95 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
33 mm
33 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
2
2
Clock Frequency-Max
166.66 MHz
Number of DMA Channels
4
Package Equivalence Code
BGA1023,32X32,40
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